During the IC design process, we start the process of package design & development.

Before the completion of design, we finalize the following packaging activities:

Prior to tape:

selection and design

thermal & electrical simulation

mechanical build & trial assembly

After tape out:

live assembly optimization

full package qualification

ongoing reliability monitoring

Our packaging qualification is customizable to meet the varying needs ot customers. Upon request, we will develop specialized qualifications plans to meet the product's market requirements.

We offer all commercially available and custom designed packages offered by the major assembly houses, such as QFN, BGA, FCBGA, SOIC, PLCC, DIP