Copyright 2004 LynXemi Pte Ltd. All Rights Reserved.
Above: Probing large SoC die with 2000 bumps using vertical probe card
Services
We engage our customers early in the design cycle. We provide consulting services on
the IP and process technologies availabe in the market; sharing our experience with
various IP, processes and fabs, we provide valuable information to our customers that
enables them to select the appropriate process technology, fab and IP for their products.
We then setup the manufacturing flow for development and production management of our customers' products in the selected fabs.
Probe
Whether cantilever or vertical probes, we can build and realize wafer probe of greater than 2000 pins. Our suppliers provide the highest quality probe cards, thus enabling us to get it right the first time.
After the transfer of the GDSII database to the fab, we engage the fab on the Following Activities:
probe program development
probe card design, fabrication and debug
laser repair program development
probe program optimization
e-test & probe data collection, analysis & report generation
yield enhancement
yield monitoring & reporting
Below: Sample graph from yield monitoring & reporting using dataConductor