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Above:  Probing large SoC die with 2000 bumps using vertical probe card

                       Services


                                               We engage our customers early in the design cycle.  We provide consulting services on
                                               the IP and process technologies availabe in the market; sharing our experience with
                                             various IP, processes and fabs, we provide valuable information to our customers that
                                 enables them to select the appropriate process technology, fab and IP for their products. 
                         We then setup the manufacturing flow for development and production management of our customers' products in the selected fabs.




Probe
Whether cantilever or vertical probes, we can build and realize wafer probe of greater than 2000 pins.  Our suppliers provide the highest quality probe cards, thus enabling us to get it right the first time.

After the transfer of the GDSII database to the fab, we engage the fab on the Following Activities:

        probe program development
        probe card design, fabrication and debug
        laser repair program development
        probe program optimization
        e-test & probe data collection, analysis & report generation
        yield enhancement
        yield monitoring & reporting

Below:  Sample graph from yield monitoring & reporting using dataConductor
TM